先不談三星挖角成功or叛將了，我們請google大神來看看台積未來n10發展趨勢。
首先來看看n10要用什麼技術
http://www.asml.com/doclib/investor/asml_3_Investor_Day-Many_ways_to_shrink_MvdBrink1.pdf
Slide25~30
1.10nm logic design can be done in 1D
..but at the penalty of 15% larger die at comparable design rules
2.EUV: reduced complexity & design rule simplification
Allowing 2D structures and potentially better yield
3.EUV lowest cost and complexity for 2D structures
4.Continued significant cost reduction viewed as possible
5.EUV supports “free functionality” for the 7nm node
再來看看台積對EUV技術的投資
http://optics.org/news/5/11/35
TSMC orders production EUV systems
ASML said that two NXE:3350B EUV systems were scheduled for delivery to TSMC
in 2015, while two other NXE:3300B systems that the chip maker already owns
will be upgraded to the full production-scale performance.
→已有兩台再追加兩台EUV量產機
http://electronics360.globalspec.com/article/4760/tsmc-orders-euv-lithography-tools-for-production
The new NXE:3350B machines are reported to cost €70 million (about US$90
million) although whether TSMC will pay that price or obtain discounts as
first user is likely to remain confidential
Van Hout said that 40W source has been demonstrated for continuous operation
for more than two months and that 80W operation was good for 24 hours and
that 100W has been demonsrated for a 60-minute run. An optical source power
of 80W is equivalent to about 55 wafers per hour or 500 wafers per day.
→一台EUV要價USD$90million →四台=360million USD
→80W EUV可提供55wafers/hour或是500 wafers/day
http://www.asml.com/doclib/investor/asml_6_Investor_Day-EUV_FvHout1.pdf
Slide13，Continuous stable source operation at 80W for 24 hrs.
→TSMC EUV機台已可提供穩定80W EUV power
→目前有2台x500 wafers/day 的n10產能
http://www.asml.com/doclib/investor/asml_6_Investor_Day-EUV_FvHout1.pdf
slide 17
Availability =50% →平均而言，兩台只有一台在工作，但技術會隨時間變成熟。
總結：當眾多媒體還在唱雖台積電，但老張已經默默的帶領台積進入下一世代，
即便叛將再強，能影響的也只是一個世代的製程，畢竟新一代的製程又是
新的挑戰。
附記：柯P曾說過「阿米巴（原蟲）被電到都會調整方向，連阿米巴的能力都沒有。」
若是在PTT還不會用google判斷媒體的是非對錯，其實跟阿米巴也相差不遠了。