https://www.hardocp.com/article/2018/04/09/intel_rumors_kaby_lakex_skylakex_cascade_lake
https://goo.gl/7UQZ7k
We will see refreshes to the Skylake-X CPUs in late Q318 or early Q418. These
will stretch from 6 to 18 cores. The Skylake-X will not feature any
architecture changes. It will however be moving from PTIM (Polymer Thermal
Interface Material) to STIM (Solder Thermal Interface Material) for its
Integrated Heat Spreader connection. This seems to be a reaction to Intel
needing to keep pace with its tiny jumps in performance. Currently the STIM
parts are reaching for a +150MHz to +200MHz on base and turbo frequencies as
a result of the PTIM to STIM change. (Now if Intel would do this for its
"enthusiast" K-SKU parts!) Intel is looking to target bins pushing ~5GHz on
12 and 14 core parts (WOW!) with an estimated TDP range of 275w to 300w on
Socket R. This TDP bump will assuredly will require new VRM layouts on
motherboards, so we will see some new boards out to address these CPUs
specifically and it looks that SuperMicro is at the front of the pack on
that. SuperMicro tipped its hand to this at CES showing off 300W TDP support.
Cascade Lake-X 預計 2018 年 Q3~Q4發售，會改回焊錫。
12c 和 14c 可以上 5Ghz。不過 TDP 變成 275W ~ 300W

想跟FX9590尬功耗嗎

14c all core 5g 300w還行吧

14c 5g 300w其實還好吧，不過，不過製程很明顯是10nm+

最好14C 5G功耗還能壓在300W附近啦，除非真的大進步用現在12C/10C看，1920X 4G 380W~400W功耗7900X 10C 4.5G 300W，都用IBT燒的結果

高頻多核功耗有哪家能壓得下？本來就要10nm甚至是7nm才能壓得住的東西。