請教一些新手問題。
active、tape out、ramp up，這些半導體界常看到的術語翻成白話是什麼啊？
以上，肉腳新手發問，跪求前輩慈悲指教。
tape out
http://zh.wikipedia.org/wiki/%E4%B8%8B%E7%B7%9A
ramp up
https://qualitytaiwan.wordpress.com/2013/09/18/ramp-up-ramp-up-time/
各步驟順序：
http://en.wikipedia.org/wiki/Integrated_circuit_design
Feasibility study and die size estimate
Function analysis
System Level Design
Analogue Design, Simulation & Layout
Digital Design, Simulation & Synthesis
System Simulation & Verification
Layout review
Design For Test and Automatic test pattern generation
Design for manufacturability (IC)
Tape-in
Mask data preparation
Tape-out 將設計好的晶片下線生產
Wafer fabrication
Die test
Packaging 封裝
Post silicon validation and integration
Device characterization
Tweak (if necessary)
Datasheet generation Portable Document Format
Ramp up 良率爬升到可以量產的階段
Production 量產
Yield Analysis / Warranty Analysis Reliability (semiconductor)
Failure analysis on any returns
Plan for next generation chip using production information if possible
可是還是沒有查到active這個步驟，哭哭