1. 標的：MU.US
2. 分類：討論
3. 分析/正文：
官方新聞稿 https://t.ly/F5BU
June 28, 2023 at 4:04 PM EDT
Further reducing wafer starts to approach 30% in both DRAM and NAND
BOISE, Idaho, June 28, 2023 (GLOBE NEWSWIRE)

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