台灣高通（QUALCOMM）2019年實習生招募中！預計上班時間為2019年寒假，職缺如下：
- Intern, Product Test Engineering (E1967236)
- Intern, Characterization Engineer (E1967391)
- Intern, Finger Print Process Engineer (E1967392)
- Intern, Test Engineer (E1967393)
- Intern, Supplier Quality Engineering (E1967394)
- Intern, Reliability Engineering (E1967395)
- Intern, Thermal Engineer (E1967396)
- Intern, Test Circuit Design Engineer (E1967425)
- Intern, RMA Engineer (E1967467)
- Intern, Device Data Analysis Engineer (E1967468)
- Intern, Spice Model Engineer (E1967470)
- Intern, Product & Test Engineering (E1967511)
- Intern, Reliability Engineer (E1967513)
- Intern, Planner (N1967390)
薪資範圍：月薪23,100~40,000元，依工作時數計算
招募需求:
1. 實習期間須為在校生。
2. 歡迎電機電子、物理、材料、化工、工業工程管理等科系之碩班學生應徵。
3.實習時數每周至少20個小時，為期三個月以上。
4. 請將您的英文履歷和成績單寄至 [email protected] 並註明您要應徵的
職缺.
詳細職缺內容請至www.qualcomm.com/careers 並用上列職缺號碼搜尋。