Intel is Hiring Technology Development Engineer in Dalian, China
We are looking for engineers at ALL levels that are excited to be part of one
of Intel's fast growing business unit, NSG Non-Volatile Memory Solutions Group
. Leveraging success of 3D NAND high volume manufacturing facility, we are ram
ping up Dalian Technology Development (TD) organization. Join us and help us c
reate the next generation memory technology that serves world’s explosive gro
wth of data storage needs and challenges.
We have several positions in process and process integration areas:
Position 1- Intel Technology Development Process Engineer
This job requisition is look for multiple candidates for the positions of Proc
ess Engineer, with work location in Dalian, China, reporting to TD Module Engi
neering Managers. The selected candidates will be responsible for activities
covering process, equipment, materials, and operations in their respective are
as of expertise, such as CVD/PVD/CMP/Diffusion/Implant/Metro/Lithography/Wet E
tch/Dry Etch.
Examples of scope of work include silicon process improvement and product enha
ncement, equipment capability evaluation and expansion, and wafer cost reducti
on.
Candidates must have demonstrated a track record of excellence in creative pro
blem solving, equipment capability enabling, or manufacturing process optimiza
tion in a relevant engineering organization.
Responsibilities include:
‧ Perform feasibility study and provide module level process solutions
to meet desired device specification and process improvement requirements
‧ Lead new process experimentation, implementation and high volume manu
facturing readiness in the area of expertise
‧ Define, select and qualify the equipment platforms to meet quality an
d output needs of new processes for high volume manufacturing ramp.
Position 2- Intel Technology Development Yield and Integration Engineer
This job requisition is look for multiple candidates for the positions of Yiel
d Engineer, FA Engineer, Defect Reduction Engineer, Integration Engineer, Devi
ce Engineer, Quality and Relibility Engineer, and Test Engineer, reporting to
TD Integration or Device Engineering Managers.
Examples of scope of work include silicon process improvement and product enha
ncement, device capability evaluation and expansion, and wafer cost reduction.
Candidates must have demonstrated a track record of excellence in creative pro
blem solving, device or test capability enabling, or manufacturing process opt
imization in a relevant engineering organization.
Responsibilities include:
‧ Perform feasibility study and provide integrated process solutions to
meet desired device specification and process improvement requirements
‧ Lead new device experimentation, implementation and high volume manuf
acturing readiness in the area of expertise
‧ Define, explore and qualify new integrated process solutions to meet
quality and output needs of new processes for high volume manufacturing ramp.
Qualifications